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BM10B-ZESS-TBT(LF)(SN) — JST product photo

JST BM10B-ZESS-TBT(LF)(SN) ZE Header 10-Pos 1.5mm Pitch SMT

MPNBM10B-ZESS-TBT(LF)(SN)
Active

JST ZE series, 10-position single-row shrouded header, 1.50 mm pitch, surface-mount, locking ramp, 2 A, 100 V, UL94 V-0 natural PA, tin-plated contacts.

$1.1900Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

BM10B-ZESS-TBT(LF)(SN) Technical Specifications
ParameterValue
SeriesZE
GenderOuter Shroud Contact
Mounting typeSurface Mount
Connector typeHeader
Fastening typeLocking Ramp
Voltage rating100V
Current rating2A
Operating temperature-25°C~85°C
Contact materialCopper Alloy
Insulation colorNatural
Insulation height0.295\" (7.50mm)
Insulation materialPolyamide (PA), Nylon
Mated stacking heights9.4mm
Material flammability ratingUL94 V-0
StyleBoard to Cable/Wire
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesPick and Place, Solder Retention
ShroudingShrouded - 4 Wall
TerminationSolder
Contact shapeRectangular
Rows1
Pitch0.059\" (1.50mm)
Positions10
Contact finish - postTin
Contact finish - matingTin

Product details

Board Layout Fit: 1.50 mm Pitch and 9.4 mm Stack Height

Current and Contact Duty: 2 A with Tin Plating

For higher reconnect frequency, a gold-plated sibling in the ZE series would extend contact life.

The natural PA housing and tin-plated copper alloy contacts are free of restricted substances.

Frequently asked questions

What is the pitch of the JST BM10B-ZESS-TBT(LF)(SN) header?

The mating pitch is 1.50 mm (0.059 inches). This is the centre-to-centre spacing between adjacent pins, which determines the matching receptacle pitch and the PCB footprint.