120-Position High-Speed Backplane Header
The TE Connectivity 1934269-1 is a Z-PACK TinMan series header, male pins, designed as a high-speed backplane connector. It packs 120 positions across 15 rows and 8 columns on a 0.075" (1.90 mm) pitch — a grid layout sized for differential-pair routing in telecom and datacom switching equipment. The press-fit termination eliminates solder, which means no thermal stress on the board during assembly and easier rework if a pin is damaged.
Press-Fit Termination and Board Layout
Press-fit through-hole mounting is the standard for high-density backplane connectors. The compliant pin cold-welds into the plated through-hole — no solder joint, no flux residue, no reflow profile to manage. For the board layout engineer, the 0.075" pitch means trace escape from the inner columns of an 8-column header will require blind or buried vias in a multilayer backplane. The 120 positions are fully loaded — no optional empty positions to account for.
Signal-Level Current Rating and Contact Plating
Rated 0.5 A per contact, this is a signal-level interconnect — not a power header. The fine pitch and dense grid limit per-contact current; the total aggregate across all 120 positions is 60 A, but that heat is distributed across the entire connector body. The gold contact finish at 30.0 µ" (0.76 µm) is a heavy plating grade that supports repeated mating cycles — critical in a backplane where line cards are swapped during the system's service life. The 250 V voltage rating is adequate for the signal levels these pins carry.
Environmental and Compliance
The operating temperature range of -65°C to 90°C covers cold storage and transport extremes while the 90°C top end suits a forced-air-cooled backplane environment. The UL94 V-0 flame rating on the black housing meets the flammability requirement for equipment inside an enclosure — a standard compliance box for telecom and datacom builds. ROHS3 compliant.