High-Density Backplane Header for 0.075" Pitch Routing
The TE Connectivity 1934312-1 is a 120-position Z-PACK TinMan header, arranged as 12 rows by 10 columns on a tight 0.075" (1.90mm) pitch. This high-speed backplane connector uses press-fit compliant pins for solderless assembly into plated through-holes, giving a reliable gas-tight connection that survives rework cycles.
The press-fit termination eliminates soldering, which means no thermal stress on the backplane and easier field replacement of a damaged header. The compliant pin geometry is designed for a specific plated through-hole size — verify the board drill diameter against the TE application drawing before layout. The through-hole mounting keeps the header anchored against the insertion forces of the mating receptacle.
0.5A Per Contact — Signal Duty, Not Power
Rated at 0.5A per contact, this header is intended for signal-level currents in a high-density backplane. The 250V voltage rating provides adequate margin for typical logic-level and low-voltage differential signals. The limiting factor at this pitch is the temperature rise from the sum of all active pins — derate if populating every position near the current limit simultaneously.
The 1934312-1 mates with the corresponding Z-PACK TinMan receptacle (female connector) of the same column and row count. The 0.075" pitch and 12-row grid are specific to the TinMan family — confirm the receptacle part number matches the 120-position layout before committing to a BOM. No cross-series compatibility is assumed.