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3MIC & Device Sockets

3M IC & Device Sockets — 44 part numbers with specifications and datasheets. Filter by key specs and request a quote on IC Source Direct.

Base Product Number
203 · 214 · 216 · 220
Number of Positions or Pins (Grid)
3 (Rectangular) · 14 (2 x 7) · 16 (2 x 8) · 20 (2 x 10)
Type
Transistor, TO-3 and TO-66 · DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing · DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing · DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled · Polysulfone (PSU), Glass Filled · Polyester, Glass Filled · Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature
-55°C ~ 150°C · -55°C ~ 125°C · -25°C ~ 85°C · -40°C ~ 105°C
Pitch - Post
0.234" (5.94mm) · 0.100" (2.54mm) · 0.070" (1.78mm) · 0.050" (1.27mm)
Contact Finish Thickness - Mating
30.0µin (0.76µm) · 35.4µin (0.90µm) · 160.0µin (4.06µm)
Contact Finish Thickness - Post
30.0µin (0.76µm) · 35.0µin (0.90µm) · 160.0µin (4.06µm)

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