The Amphenol FCI BERGSTIK II 68024-120HLF is a single-row, 20-position unshrouded board-to-board header in the 0.100-inch (2.54 mm) pitch BERGSTIK II family — a workhorse through-hole header series used across industrial control, instrumentation, and consumer electronics board assemblies where a low-profile, affordable male pin header mates with a matching IDC or solder-cup receptacle. This member carries gold or Gold GXT contact plating at 30.0 µin (0.76 µm) thickness on the mating interface, rated 5 A per circuit at up to 110 V, with push-pull fastening and square-pin contact geometry for through-hole solder termination. The housing is black glass-filled nylon rated UL94 V-0.
Key ratings and what they mean
The 5 A per-contact current rating is governed by the phosphor bronze contact material and the 30.0 µin gold plating thickness — the gold layer resists fretting corrosion at the mating interface across repeated cycles without requiring tin-lead solder compatibility. The 110 V rating is typical for signal-level board-to-board applications in this pitch class; verify it against your system's working voltage with appropriate derating for any transient or combined-stress condition. The push-pull fastening on an unshrouded header provides a manual mate/demate retention force — adequate for static or semi-static board-stacking; it is not a vibration-locked latching system. The 0.318-inch (8.08 mm) mating length and 0.100-inch (2.54 mm) insulation height define the mated stack geometry — check the z-height budget against your board-spacing requirement. All 20 positions are loaded — every circuit site is populated, so the full 20-circuit footprint applies. The square pin cross-section accepts standard 2.54 mm header sockets and is compatible with Proto-board and most IC socket footprints.