The Amphenol FCI (FCI) 79425-448HLF is the 48-circuit member of the BERGSTIK II board-to-board header series. It is a dual-row, unshrouded male pin header with 0.100-inch (2.54 mm) pitch, rated 5 A per contact at 110 V — the kind of fixed-stack header you'd specify when two parallel PCBs need a compact, through-hole interconnect with a known and repeatable footprint. All 48 positions are loaded. The contacts are square-pin phosphor bronze with 100 µin (2.54 µm) tin plating on both the mating face and the solder-tail post, which is the standard grade for solder-through board connections where re-mating cycles are incidental rather than primary.
Board-to-board stacking fit
The 0.100-inch row spacing matches the industry-standard pitch used across the BERGSTIK II series, so the board footprint — including annular ring, hole size, and pin-1 orientation — is a known quantity. The 0.100-inch (2.54 mm) insulation height gives a nominal 2.54 mm board-stack separation when mated to a compatible receptacle. The push-pull fastening type means it relies on the header-to-receptacle friction fit rather than a screw lock or latch; confirm the vibration environment can tolerate that. The post tail length of 0.120 inch (3.05 mm) and overall contact length of 0.410 inch (10.41 mm) are through-hole dimensions — verify pad stack-up against your PCB thickness before committing the footprint to layout.
Plating, current, and voltage — what the ratings mean
Tin-on-tin on both the mating face and the solder post is the practical choice for a solder-through header that will be mated a limited number of times and then left in service. The 5 A per-contact rating at 110 V places it in the low-to-medium power band — it will carry a modest power bus or act as a signal/power hybrid depending on the circuit density. The UL94 V-0 black housing material meets the baseline flame-retardance requirement for enclosed industrial equipment.
Sourcing
The 79425-448HLF is listed as Active. No official successor or cross-reference is on record. The 48-position count, dual-row layout, and tin plating confirm the series-level BOM match — verify the position count against your board layout before placing the order. Sourced to order against RFQ; contact your distributor for lead time and MOQ on the BOM quantity.