Board-to-Board Header for Automated Assembly
Surface-mount termination with a pick-and-place feature means the part is reflow-ready and compatible with automated placement equipment — no hand-solder step required.
Gold GXT™ Mating Surface and Current Rating
The tin-plated solder tail (78.7 µinch thickness) wets well during reflow.
The Tape & Reel and Cut Tape packaging options support both volume and prototype builds.
