Amphenol ICC (FCI) Minitek® 2.00mm, Board to Board Header, 20 Positions, 2 Rows, 0.079" (2.00mm) Pitch, Surface Mount, Unshrouded, Gold GXT™ Mating, Tin Post, 2A, 200V, UL94 V-0, Bulk.
| Parameter | Value |
|---|---|
| Series | Minitek® 2.00mm |
| Gender | Male Pin |
| Mounting type | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 200V (AC/DC) |
| Current rating | 2A (AC/DC) |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 20 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.157\" (4.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 57202-G52-10LF: The SMT termination and push-pull fastening mean the header reflows with the board and holds the receptacle by friction alone — no secondary latch.
The 26-position 57202-G52-13LF is the next step up in the same series — same pitch, same plating, same current — but adds six more circuits for a wider board interface.
No through-hole posts to clinch, so the board-side footprint is just the pad pattern and the alignment pegs (if present) handle shear during the mating cycle.
Sourced through independent distribution against your BOM quantity. Submit an RFQ for a firm quote.
The 57202-G52-13LF is the same header in a 26-position version — same pitch, same gold plating, same 2 A rating. If you need fewer circuits, the 16-position 57202-G52-08LF or 14-position 57202-G52-07LF are direct drop-ins at their respective position counts.