0.50 mm pitch, 18-position ZIF — board-edge signal interconnect
The SFV18R-1STE1HLF: This is an 18-circuit FFC/FPC connector from the SFV-R series, built for board-edge signal routing where height is tight. The ZIF flip-lock mechanism accepts a 0.30 mm-thick FPC and holds it without insertion force, which avoids pad wear during assembly. The 1.80 mm height above board leaves room for components underneath on the opposite side.
Mating and termination — FPC thickness and cable end type
The contacts are bottom-side (contact type: Contacts, Bottom), meaning the cable's conductive pads face downward toward the PCB when inserted. Termination is solder — the SMT pads are soldered to the board during reflow.
