1.00 mm Pitch ZIF FFC/FPC Connector for Board-Level Interconnect
The vertical through-hole orientation places the FPC perpendicular to the board, keeping the z-height at 5.50 mm above the PCB. The 20 mating cycles reflect the tin finish — adequate for set-and-forget installations where the FPC is mated once during assembly and rarely reconnected in the field. Accepts FPC thickness of 0.33 mm.
The SLW-S series offers the same 1.00 mm pitch, 5.50 mm stack height, and ZIF slide-lock design in 12-position (SLW12S-1C7LF), 14-position (SLW14S-1C7LF), and 15-position (SLW15S-1C7LF) variants. All share tin-plated contacts, 1 A rating, and 20 mating cycles.
