The header terminates via press-fit or solder tails through a through-hole PCB. The press-fit option allows solderless assembly for high-reliability backplane applications, while the solder tails provide a conventional mount. Mated stacking height is 11.3 mm, and the post length (0.134") ensures adequate solder joint exposure on the PCB bottom side.
Peer comparison: 8-position vs 9-position, and RoHS variants
The 9-position B09B-XASK-1 is one position denser than the 8-position B08B-XASK-1(LF)(SN), sharing the same 2.50 mm pitch, locking ramp, and 3 A rating. Between the B09B-XASK-1 and its RoHS-compliant sibling B09B-XASK-1(LF)(SN), the specs are identical except for the lead-free plating on the latter. The B09B-XASK-1-A variant adds a board guide feature.