2.00 mm pitch SMT header for wire-to-board designs
The BM10B-PUDSS-TFC: This JST PUD series header gives you a 10-position, dual-row SMT connector on 2.00 mm pitch — a common footprint for space-constrained wire-to-board interconnects. The 3 A per-contact rating with tin-plated contacts is suited for signal and low-power distribution inside equipment enclosures where the connector sees infrequent mating cycles. The latch holder fastening provides a positive mechanical lock against vibration disconnection, and the shrouded four-wall design protects the male pins during handling and mating.
PUD series compatibility and mating half
This header mates with JST PUD series crimp receptacle housings (sold separately) to form a wire-to-board connection. The 11 mm mated stacking height is fixed by the header and receptacle housing dimensions — confirm your enclosure clearance against this height before committing the design.