20-position 1.00mm-pitch SMT header for signal-level board-to-cable
SMT assembly aids: pick-and-place pad and solder retention
Two features on this header address automated assembly: Pick and Place (a flat top surface for the vacuum nozzle) and Solder Retention (integrated hold-downs that keep the part flat during reflow). Together they eliminate the need for secondary adhesive or manual hold-downs in high-volume SMT lines. The insulation material is glass-filled polyamide (Nylon) rated UL94 V-0 — the highest common flammability grade for connectors inside enclosed equipment. The natural (off-white) color is standard for this series.
Mated stack height and board clearance
This leaves roughly 2mm of clearance under the connector body for trace routing or low-profile passives — useful when the header sits near a board edge with limited keep-out.
