CONN HEADER VERT 26POS 2.54MM
$4.47Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
- New & original stockTraceable channels only — no mixed lots, no re-taped reels.
- Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
- Photo-verified countsEvery line counted and photographed before the box closes.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | Flex Stack, HTST |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3.4A per Contact |
| Operating temperature | -55°C ~ 125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Natural |
| Insulation height | 0.350\" (8.89mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Features | Keying Slot |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 26 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.115\" (2.92mm) |
| Overall contact length | 0.480\" (12.19mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.250\" (6.35mm) |
| Contact finish thickness - mating | 10.0µin (0.25µm) |
Sourcing this connector
Samtec Inc. HTST-113-01-L-D is available through IC Source Direct’s Shenzhen interconnect channel. Submit an RFQ with your required quantity and timeline; we return a firm quote covering MOQ, lead time, condition, and unit price — typically within one business day.
Need a match by specification instead of MPN? Provide pitch, pin count, current rating, mounting style, and operating temperature. We cross-reference against Samtec Inc. and other authorised lines, returning datasheet-verified alternatives. Attach a full BOM for multi-brand consolidation into one shipment.