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Samtec Inc. SEI-110-02-GF-S-AB-TR — Spring-Loaded Contacts

Samtec SEI-110-02-GF-S-AB-TR Spring-Loaded Contact, 10-Pos

MPNSEI-110-02-GF-S-AB-TR
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Samtec SEI series compression contact, non-gendered, order code SEI-110-02-GF-S-AB-TR, 10 positions, single row, 0.039" (1.00mm) pitch, gold-plated phosphor bronze contacts, surface-mount solder termination.

$5.1500Ref. price · indicative, final on quote
RoHSROHS3 Compliant
SeriesSEI
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

SEI-110-02-GF-S-AB-TR specifications
ParameterValue
SeriesSEI
MountingSurface Mount
Connector typeCompression Contact, Non-Gendered
Positions10
MaterialPhosphor Bronze
Pitch0.039\" (1.00mm)
PackageTape & Reel (TR) Cut Tape (CT)
Contact finishGold
Rows1
Contact finish thickness3.00µin (0.076µm)

Product details

10-position spring-loaded contact at 1.00 mm pitch

The SEI-110-02-GF-S-AB-TR is the 10-contact member of Samtec's SEI series of non-gendered compression contacts, designed for board-to-board stacking where the spring pin takes up tolerance between parallel PCBs. Contacts are phosphor bronze with 3.00µin (0.076µm) gold finish; the 1.00 mm pitch and single-row layout keep the footprint narrow for dense routing.

Plating grade and position count across the SEI series

Within the SEI family the 10-position SEI-110-02-GF-S-AB-TR shares the 1.00 mm pitch and single-row layout with the 20-position SEI-120-02-GF-S-M-AB — the position count is the only functional difference, so the board footprint scales linearly with circuit count.

Frequently asked questions

What is the difference between SEI-110-02-GF-S-AB-TR and SEI-110-02-G-S-AB-TR?

Both are 10-position, 1.00 mm pitch compression contacts from the SEI series. The GF variant has 3.00µin gold plating; the G variant has 10.0µin gold. The thicker plating on the G variant supports a higher mating-cycle life. The board footprint and mating interface are identical.