Impact 2057741-1 — 96-Position, 6-Row Header for High-Density Backplanes
The TE Connectivity 2057741-1 is a 96-position header from the Impact series, configured as a 6-row by 16-column grid on a 0.075" (1.91mm) pitch. This is the Guide Right variant, meaning the connector body includes alignment features that key the mating receptacle during blind-mate backplane assembly. The press-fit termination eliminates the thermal stress of wave soldering and allows field replacement of individual connectors from the backplane. Rated for signal-level duty at 0.75 A per contact and 30 VAC/DC, this header is designed for differential-pair routing in high-speed telecom and data-communications equipment.
The press-fit termination means the 2057741-1 is specified for a solderless backplane assembly. The compliant pin is designed to be pressed into a plated through-hole, creating a gas-tight interference fit. The through-hole mounting type confirms the PCB requires drilled and plated holes — not an SMT land pattern. The 6-row × 16-column footprint will dictate the backplane's layer count and routing channel density; the 0.075" pitch leaves room for two traces between holes on a typical inner layer, but the stack-up should be designed with the press-fit hole diameter and antipad clearance in mind.
Contact Plating and Signal Integrity
The gold thickness is sufficient to prevent oxidation of the base metal at the mating interface, which matters for signal integrity at low-level logic voltages — the 30 VAC/DC rating confirms this is a signal path, not a power rail.