Board-to-Board SMT Header for Tight Pitch Routing
The tin-plated post (50 µinch) is the solder tail; it's the board-side finish, not the mating interface, so the gold-on-gold wipe is preserved at the header-to-receptacle joint.
Peer Comparison: 20021121-00010T8LF vs This Part
The closest functional sibling is 20021121-00010T8LF — same 10 positions, same 1.27 mm pitch, same dual-row unshrouded SMT footprint, same 1 A per contact rating. The mating finish on both is gold (GXT™ 30 µinch on the D8LF, gold on the T8LF), so the signal-path reliability is the same.
Termination is surface-mount solder — no through-hole, no press-fit. The Pick and Place feature (flat top surface) means the header is compatible with automated assembly equipment, so the contract manufacturer can place it on the board without a manual step. The tube packaging keeps the pins aligned during transport; if the line runs tape-and-reel, the sibling 20021121-00010C8LF is the same part in Tape & Reel packaging.