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20021121-00010D8LF — Amphenol product photo
Amphenol

20021121-00010D8LF Amphenol ICC (FCI) Minitek127 1.27mm

MPN20021121-00010D8LF
Active

Amphenol ICC (FCI) Minitek127® 1.27mm, Board to Board, Header, 10 Positions, 2 Rows, 0.050" (1.27mm) Pitch, Surface Mount, Solder Termination, Unshrouded, Push-Pull, Black, Tube, Pick and Place, 1A per Contact, 125VAC, -55°C~125°C, UL94 V-0, Gold GXT™ Mating Finish 30.0µin, Tin Post Finish 50.0µin, RoHS Compliant, Active

$0.9900Ref. price · indicative, final on quote
20021121-00010D8LF datasheet
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
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Specifications

20021121-00010D8LF Technical Specifications
ParameterValue
SeriesMinitek127® 1.27mm
GenderMale Pin
Mounting typeSurface Mount
Connector typeHeader
Fastening typePush-Pull
Voltage rating125VAC
Current rating1A per Contact
Operating temperature-55°C~125°C
Contact materialCopper Alloy
Insulation colorBlack
Insulation materialThermoplastic
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesPick and Place
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.050\" (1.27mm)
Positions10
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin
Contact finish - matingGold, GXT™
Contact length - mating0.120\" (3.05mm)
Contact finish thickness - post50.0µin (1.27µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Board-to-Board SMT Header for Tight Pitch Routing

The tin-plated post (50 µinch) is the solder tail; it's the board-side finish, not the mating interface, so the gold-on-gold wipe is preserved at the header-to-receptacle joint.

Peer Comparison: 20021121-00010T8LF vs This Part

The closest functional sibling is 20021121-00010T8LF — same 10 positions, same 1.27 mm pitch, same dual-row unshrouded SMT footprint, same 1 A per contact rating. The mating finish on both is gold (GXT™ 30 µinch on the D8LF, gold on the T8LF), so the signal-path reliability is the same.

Termination is surface-mount solder — no through-hole, no press-fit. The Pick and Place feature (flat top surface) means the header is compatible with automated assembly equipment, so the contract manufacturer can place it on the board without a manual step. The tube packaging keeps the pins aligned during transport; if the line runs tape-and-reel, the sibling 20021121-00010C8LF is the same part in Tape & Reel packaging.

Frequently asked questions

Where can I buy 20021121-00010D8LF and check stock?

The Active lifecycle status means the factory is still producing this header, so there is no supply risk from an end-of-life notice.

What is the mating female socket for 20021121-00010D8LF?

The mating half is a Minitek127® 1.27mm female socket (receptacle) with 10 positions, dual-row, 1.27 mm pitch.

What is the closest functional second-source to 20021121-00010D8LF?

The closest sibling is 20021121-00010T8LF — same 10 positions, same 1.27 mm pitch, same dual-row unshrouded SMT footprint, same 1 A rating. The only difference is the post finish: the D8LF uses a 50 µinch tin post; the T8LF uses a tin post. The mating finish on both is gold, so the signal-path reliability is identical. For a BOM cost review, the T8LF is a drop-in candidate.