Board-fit and footprint specs
Board locks on the SMT feet anchor the part during reflow and add shear resistance once mated. The current per circuit is limited by the contact beam geometry and the 1.27 mm pitch, not the plating. For anything above signal levels, look at a wider-pitch series.
Mating interface and contact finish
The solder tails are tin-lead (150.0 µin), which is a standard hot-solder-dip finish for SMT reflow. In a high-vibration environment, consider a header with a positive locking mechanism.
RoHS non-compliant due to the tin-lead post finish. If your build requires RoHS, this part is not an option unless you have an exemption. The housing is LCP with UL94 V-0 flammability rating, which is standard for inside-enclosure use.
Application range
The 9.91 mm stack height is common in mezzanine board-to-board interconnects where the two PCBs are parallel and spaced by that z-height.