1.27mm pitch, 20-position board-to-board header for dense stacking
The 104895-2: The 1.27mm pitch and 1.27mm row spacing keep the footprint tight — useful when routing between two PCBs in a mezzanine stack or parallel board assembly. Rated 0.5A per contact, this is a signal-level connector, not a power rail.
Gold vs tin: why the 30µin plating matters for your duty cycle
The 104895-2 carries 30µin gold on the mating contact, compared to the 3µin gold on peer 1318699-3 or the tin finish on 1-1871673-2. For applications requiring frequent connect/disconnect — test equipment, field-replaceable modules, or medical devices — the thicker gold reduces contact fretting and maintains stable resistance over thousands of cycles.
Active production, RoHS non-compliant — plan for the lead exemption
RoHS non-compliant due to tin-lead plating on the solder tails (150µin thickness). If your assembly requires RoHS exemption or a lead-free alternative, confirm the exemption scope before committing the BOM line.
Mates with AMPMODU 50/50 Grid receptacles — confirm the stack height
The 0.213" (5.40mm) insulation height sets the mated stack height — verify the receptacle counterpart's standoff to ensure the board-to-board gap meets your enclosure clearance.