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68695-172 — Amphenol product photo

Amphenol BERGSTIK II 68695-172, 72-pos 0.100" Header, 5 A

MPN68695-172
Active

Amphenol BERGSTIK® II 68695-172, 72-position dual-row 0.100" (2.54 mm) pitch male pin header, right-angle through-hole mount, rated 5 A per contact at 110 V, gold or Gold GXT™ plating 30.0 µin (0.76 µm), insulation height 0.190" (4.83 mm), UL94 V-0, bulk package.

$6.2730Ref. price · indicative, final on quote
StockIn Stock (24)
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

68695-172 Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole, Right Angle
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.190\" (4.83mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBulk
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions72
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.090\" (2.29mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.230\" (5.84mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The Amphenol BERGSTIK® II 68695-172 is a 72-position dual-row male pin header on a standard 0.100" (2.54 mm) pitch — the same pitch as legacy DIP packages and ribbon-cable IDC connectors, so the footprint fits a familiar grid. Rated 5 A per contact at 110 V, with 30.0 µ" (0.76 µm) gold or Gold GXT™ plating on the mating surface — a plating thickness that supports hundreds of mating cycles in a controlled environment without significant wear.

72 positions across two rows at 0.100" pitch means the board footprint is a 2 x 36 grid with 0.100" row spacing — a dense but routable pattern for signal-level traces. The 0.230" (5.84 mm) mating pin length provides enough wipe for a standard box-header receptacle; the 0.090" (2.29 mm) solder post length is short, so the board thickness and plated-through-hole depth need to be checked against the post for proper solder fillet formation. Insulation height of 0.190" (4.83 mm) above the board leaves clearance for passives or traces running under the header body.

Frequently asked questions

What is the mounting type for 68695-172?

Right-angle through-hole — the pins exit parallel to the board surface, making it suitable for board-edge or mezzanine applications.

What is the pitch of 68695-172?

0.100" (2.54 mm) pitch on both the pin-to-pin and row-to-row spacing — a standard grid compatible with many IDC and box-header receptacles.