Amphenol ICC (FCI) DILB14P-223TLF, 14-pin DIP socket, 0.3" (7.62mm) row spacing, 0.100" (2.54mm) pitch, tin-plated contacts, 1 A rating, UL94 V-0 nylon housing, through-hole solder termination.
| Parameter | Value |
|---|---|
| Type | DIP, 0.3\" (7.62mm) Row Spacing |
| Mounting | Through Hole |
| Current rating | 1 A |
| Operating temperature | -55°C~105°C |
| Housing material | Polyamide (PA), Nylon |
| Contact material - post | Copper Alloy |
| Contact material - mating | Copper Alloy |
| Material flammability rating | UL94 V-0 |
| Package | Tube |
| Features | Open Frame |
| Termination | Solder |
| Pitch - post | 0.100\" (2.54mm) |
| Parameter | Value |
|---|---|
| Pitch | 0.100\" (2.54mm) |
| Contact resistance | 30mOhm |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Termination post length | 0.124\" (3.15mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
| Number of positions or pins | 14 (2 x 7) |
The DILB14P-223TLF: The open-frame design allows airflow around the IC body, which helps thermal management in dense boards. Rated 1 A per pin with tin-on-tin contact interface.
Supplied in tube packaging.
Yes, the manufacturer lists it as RoHS compliant.