TE Connectivity AMPMODU System 50, Header, 34 Positions, 0.050" (1.27mm) Pitch, Dual Row, Shrouded - 2 Wall, Through Hole, Solder, Gold Mating Contact, Latch Holder, Black Insulation, UL94 V-0
| Parameter | Value |
|---|---|
| Series | AMPMODU System 50 |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Latch Holder |
| Voltage rating | 30VAC |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.390\" (9.91mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Tube |
| Shrouding | Shrouded - 2 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Telecommunications |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 34 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.100\" (2.54mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.125\" (3.18mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 1-104068-3: This is a 34-position, dual-row header on a 0.050" (1.27mm) pitch — the tightest pitch in the AMPMODU System 50 series. The row spacing is 0.100" (2.54mm), so the overall footprint is 17 positions per row across a 1.27mm column grid. That pitch drives the PCB routing density: traces between pads need a narrow neck, typically 0.15mm to 0.20mm on a standard 1oz copper layer.