Skip to main content
TE Connectivity AMP Connectors 1-1546214-4 — Pin Headers, Sockets & Housings

1-1546214-4 TE Buchanan Header, 14 Pos 5.00mm

MPN1-1546214-4
Active

TE Connectivity AMP Connectors Buchanan header, order code 1-1546214-4, 14 positions, single level, 5.00 mm pitch, tin-plated male pins, through-hole vertical, solder termination, UL94 V-0 PA66 housing.

$1.6300Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

1-1546214-4 specifications
ParameterValue
TypeHeader, Male Pins, Unshrouded
SeriesBuchanan
MountingThrough Hole
Operating temperature-40°C~110°C
ColorGray
Contact materialCopper Alloy
Housing materialPolyamide (PA66), Nylon 6/6
Insulation height0.079\" (2.00mm)
Material flammability ratingUL94 V-0
Pitch0.197\" (5.00mm)
PackageBulk
Number of levels1
Termination styleSolder
Header orientationVertical
Contact tail length0.138\" (3.50mm)
Positions14
Positions per level14
Contact mating finishTin

Product details

Unshrouded header for board-level power distribution

The 1-1546214-4 is the 14-position member of TE's Buchanan unshrouded pin header line, built for through-hole vertical mounting on a 5.00 mm pitch. Tin-plated mating finish on copper alloy contacts keeps the per-circuit cost low for power and signal interconnects where the mating cycle count stays under a few dozen. The PA66 housing carries a UL94 V-0 flammability rating and the assembly runs from -40°C to 110°C.

What the 5.00 mm pitch and unshrouded format mean for the board layout

The 5.00 mm pitch leaves generous trace routing space between pins on a standard FR-4 board — no need for tight neck-downs or extra layers to fan out the 14 circuits. The unshrouded header exposes the pins for direct probing or manual wiring, but offers no keying or polarization against a misaligned mate. Single-level construction with 14 positions per level keeps the board footprint compact in one axis. Through-hole solder termination provides a mechanically robust joint for wire-to-board connections that see occasional handling.