100-Position Board-to-Board Receptacle for Dense Parallel Routing
The 1-1734037-0: The outer shroud contacts provide a guided mating envelope, reducing the risk of pin damage during blind assembly in a backplane or daughtercard configuration.
The gold flash contact finish is a thin gold layer over the base metal, sufficient for the limited mating cycles typical of a board-to-board interconnect (one or two mates during assembly and test). For applications requiring frequent field disconnect or high cycle life, a thicker gold plate would be specified.
No stock-holding claim is made.