The TE Connectivity 1-1734037-2 is a 120-position board-to-board receptacle from the CHAMP.050 I series. Board locks on the mounting posts anchor it through the solder wave, handling the insertion force of a 120-position mate without lifting pads.
Pitch, row layout, and PCB footprint
The 0.050-inch (1.27 mm) pitch is standard for the CHAMP.050 I dense interconnect line. Two rows carrying 60 positions each means the PCB footprint takes up about 1.5 inches of board-edge real estate. Each row's pad pattern is a straight line at 0.050-inch centers; the two rows are staggered at the standard.100-inch row-to-row offset. That keeps routing channels between the rows for differential pairs or ground planes in the inner layers.
Termination and assembly notes
Solder termination through the through-hole pins. Board locks are integral — they snap into the PCB mounting holes before wave solder, preventing tilt during the wave. Gold flash on the mating contacts keeps corrosion away for the service life of the assembly. The outer shroud contacts mate with the matching CHAMP.050 I plug header; the shroud aligns the plug before the pins engage, reducing stubbing risk on a 120-position connector.