Termination Options: Press-Fit and Solder
The dual termination option — press-fit or solder — gives assembly flexibility: press-fit suits backplane or high-reliability solderless assembly, while solder provides a conventional through-hole joint.

TE Connectivity AMP Connectors High Performance Interconnect (HPI) header, Board to Cable/Wire, 16 positions, 2.00 mm pitch, shrouded 3-wall, locking ramp, press-fit/solder termination, tin plating, 3 A, 250 V, UL94 V-0, -25°C~85°C.
| Parameter | Value |
|---|---|
| Series | High Performance Interconnect (HPI) |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 250V |
| Current rating | 3A |
| Operating temperature | -25°C~85°C |
| Contact material | Copper Alloy |
| Insulation color | Natural |
| Insulation height | 0.239\" (6.07mm) |
| Insulation material | Thermoplastic |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Shrouding | Shrouded - 3 Wall |
| Termination | Press-Fit, Solder |
| Applications | Automotive, General Purpose, Industrial, Medical |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 16 |
| Contact finish - post | Tin |
| Contact length - post | 0.134\" (3.40mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.132\" (3.35mm) |
The dual termination option — press-fit or solder — gives assembly flexibility: press-fit suits backplane or high-reliability solderless assembly, while solder provides a conventional through-hole joint.
As a Board to Cable/Wire header, it mates with a matching 2.00 mm pitch receptacle housing that accepts the corresponding crimp terminals. The locking ramp feature requires a receptacle with a compatible latch feature.