SMT Termination with Solder Retention
The 1-1775470-2: Surface-mount termination with built-in solder retention features — the part stays seated during reflow without external hold-downs, reducing tombstoning risk on the 2.00 mm pitch footprint. Insulation height of 0.242" (6.14 mm) gives clearance for the mating receptacle's latch and wire exit angle in tight z-height budgets.
Active Production — No Cross-Reference Needed
ROHS3 compliant; housing is UL94 V-0 rated polyamide 9T.
Peer Comparison: 1376366-8 vs 1-1775470-2
The closest functional peer is 1376366-8 — an 8-position, 2.20 mm pitch, through-hole right-angle header rated 5 A with mounting brackets. The 1-1775470-2 offers 12 positions at 2.00 mm pitch, SMT, and 3 A — a different board footprint and assembly process. The 1-292164-1 is an 11-position, 2.00 mm pitch through-hole header with kinked pins and detent lock — same pitch but through-hole termination and fewer positions. Neither peer is a drop-in replacement; the 1-1775470-2 stands alone in its 12-position SMT configuration within the HPI series.