SMT Receptacle with Integrated Alignment and Protection
It is a multi-purpose connector style, meaning it is not locked into a single application class — it fits general-purpose board-to-board or wire-to-board interconnects where a compact, SMT-compatible receptacle is needed.
Contact Plating and Duty Implications
The 19.7µin (0.50µm) gold plating on the contacts is a mid-grade thickness — thick enough to handle repeated mating cycles and resist oxidation in mildly corrosive environments, but not rated for the high-cycle duty (500+ mates) that a 30µin or thicker gold flash would support. For a typical production run with a few dozen mate-unmate cycles over the product life, this plating grade is well matched. The gold is applied over the base metal; the exact underplate is not specified here, but the gold thickness alone tells you this is a signal-grade contact, not a high-current power contact.
Packaging and Assembly Fit
Supplied in Tray packaging, which is standard for SMT connectors that need to stay flat and protected through the pick-and-place process. The Board Guide feature helps self-align the part to the PCB footprint during placement, reducing tombstoning or skew. The Cover protects the contact cavity from flux splash and debris during wave or reflow soldering — a detail worth noting if your line runs no-clean flux that can wick into open housings.