Board-to-Board Fit: 2.00 mm Pitch, 14 Circuits, Right-Angle SMT
The 1-2307730-4: The mating face carries 15.0 µinch (0.38 µm) gold over phosphor bronze, which supports moderate reconnect duty — think a few hundred cycles over the product life in a controlled environment. The solder tails are tin-plated (118.1 µinch / 3.00 µm) for reliable wetting to the PCB pad.
It is ROHS3 compliant. Available through independent distribution channels. No stock-holding claim — sourced per request.
As a board-to-board receptacle, it mates with a matching 2.00 mm pitch dual-row pin header from the AMPMODU series — typically a right-angle or vertical header with 14 positions. In a vibration environment, consider a locking-header variant if the application sees shock or continuous motion. The LCP material handles the reflow profile for SMT assembly without warping the housing or shifting the contact positions.