Board-to-Board Footprint and Signal Density
The tin-plated mating surface (118.1 µin thickness) is adequate for low-cycle applications — think one-time assembly or infrequent service access.
The LCP housing (UL94 V-0) withstands reflow temperatures without warping. Bottom or top entry means the receptacle accepts a header from either side of the board — useful for mezzanine stacking where the board-to-board gap is tight.
