Board-to-Board Stacking with 2.00 mm Pitch
Gold mating finish at 3.94 µinch (0.100 µm) over phosphor bronze contacts — this is a signal-duty plating grade, not a high-cycle or high-current surface.
Pick-and-Place and SMT Assembly
The connector is marked as pick-and-place compatible — the flat top surface of the LCP housing allows vacuum nozzle pickup during automated assembly. Solder termination means the contacts are reflow-soldered to the board; the tin-plated posts (3.00 µm / 118.1 µinch) wet well with standard SAC solder pastes. No through-hole or press-fit option on this part. Cut Tape suits prototype or low-volume builds.