The 1-2314820-6 is a 16-position, dual-row, board-to-board receptacle from the TE Connectivity AMPMODU series.
Gold Mating Finish and Housing Construction
The mating interface carries 3.94 µinch (0.100 µm) gold over phosphor bronze contacts. Gold at this thickness prevents oxidation in low-current or intermittent-contact applications — the contact resistance stays stable through hundreds of mating cycles. The post finish is 118.1 µinch (3.00 µm) tin — a standard solderable coating that wets well in wave or hand-solder processes. Housing is black liquid crystal polymer (LCP) rated UL94 V-0. LCP handles the reflow temperatures of lead-free soldering without distortion and provides the dimensional stability needed for the 2.00 mm pitch contact spacing.