Board-to-Board Receptacle for Mezzanine and Parallel Stacking
The 1-2314846-0: The contact interface uses 30 µinch gold over nickel on the mating side, rated for repeated connect/disconnect cycles in field-service or production-test environments. The receptacle accepts a mating pin header (not included) and supports both bottom-entry and top-entry orientation, giving the board layout engineer flexibility in stack height and routing density.
The push-pull fastening type provides a friction-lock retention; no secondary latch or screw is required for normal handling, but vibration-prone applications should consider a header with a locking ramp if available. Termination is SMT with a pick-and-place vacuum pick area on the housing top. The contact finish on the solder post is tin (12 µinch minimum), compatible with standard lead-free reflow profiles. The 4.50 mm insulation height provides clearance for trace routing under the connector body.