Board-to-Board Stacking with AMPMODU
The 1-2314846-2: This 12-position female socket header from the AMPMODU series is a board-to-board receptacle, designed for parallel stacking or mezzanine interconnects where two PCBs run parallel to each other. Surface mount termination means the part reflows alongside other SMD components — no selective solder wave needed. The pick-and-place feature indicates the housing is compatible with vacuum nozzles and tape-and-reel feeding, though this specific order code ships in a tube.
Pitch, Positions, and PCB Footprint
Mating pitch is 2.00 mm between centres, with the same 2.00 mm row spacing — a 2×6 grid. The 0.177-inch (4.50 mm) insulation height gives the mated pair a defined stack height; the receptacle sits flush against the board surface, so the total z-height is the sum of the mating header height plus this 4.50 mm. All 12 positions are loaded — no skipped or dummy pins. The square contact geometry mates with a square pin header, which provides four-point wiping action on insertion.
Contact Plating and Current Duty
The gold layer handles the wear from repeated mating — the tin tail is purely for solderability and does not contribute to the contact interface resistance. This is a signal-level current rating — suitable for logic, data, or low-power sensor lines, not for power distribution.