The 1-2367196-2: This is a 12-position, single-row header from the High Performance Interconnect (HPI) series.
Right-Angle SMT — Board-Edge Routing and Reflow
The SMT solder tails are compatible with standard reflow profiles; pick-and-place vacuum pick area and solder retention features are built into the part for automated assembly. The 0.087-inch (2.21 mm) mating pin length engages the receptacle contact beam fully before the locking ramp clicks.
Active Production — Sourcing Posture
Packaging options include Tape & Reel and Cut Tape, which suits both high-volume reflow and prototype or low-volume builds.
The tin finish on the posts is 50.0 µinch thick, providing a reliable solder joint with standard lead-free alloys.