TE Connectivity AMP Connectors HPI series, 1-2367196-4, 14-position single-row header, 1.00 mm pitch, surface-mount right-angle, shrouded 4-wall with locking ramp, tin-plated contacts rated 2 A at 50 V, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | High Performance Interconnect (HPI) |
| Type | Male Pin |
| Mounting | Surface Mount, Right Angle |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 50V |
| Current rating | 2A |
| Operating temperature | -40°C~85°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.114\" (2.90mm) |
| Insulation material | Thermoplastic, Halogen Free |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Features | Pick and Place, Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Rectangular |
| Rows | 1 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 14 |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Contact length - mating | 0.087\" (2.21mm) |
| Contact finish thickness - post | 50.0µin (1.27µm) |
| Contact finish thickness - mating | 5.00µin (0.127µm) |
The solder retention feature is a small barb or standoff on the SMT tails that keeps the connector flat against the board during solder paste reflow, preventing tombstoning or skew from uneven wetting forces.
Confirm the receptacle part number from the HPI series catalog — the pitch and circuit count must match.