Board Layout Fit — 2.00 mm Pitch, 20 Positions, Dual-Row
The 1-2842128-0: Insulation height is just 0.059" (1.50 mm), so the header sits low on the board — useful when the z-height budget is tight between parallel PCBs.

TE Connectivity AMPMODU, Board to Board, Header, Breakaway, 20 Positions, 2.00 mm Pitch, 2 Rows, Through Hole, Solder, Gold Mating Finish, Black Thermoplastic, UL94 V-0, -40°C~125°C, 2A, 125VAC/DC
| Parameter | Value |
|---|---|
| Series | AMPMODU |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Voltage rating | 125VAC/DC |
| Current rating | 2A |
| Operating temperature | -40°C~125°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Thermoplastic |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 20 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.110\" (2.79mm) |
| Overall contact length | 0.327\" (8.30mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.157\" (4.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 1-2842128-0: Insulation height is just 0.059" (1.50 mm), so the header sits low on the board — useful when the z-height budget is tight between parallel PCBs.