20-Position, 2.00mm Pitch: The Board-to-Board Fit
Gold plating on the mating face at 15.0µinch (0.38µm) over a copper alloy base keeps contact resistance low through repeated mate cycles — rated for signal-level current at 2A per contact and 125VAC/DC. The unshrouded, push-pull design means no polarization key; the board layout must handle orientation and the connector relies on the PCB for alignment.
Through-Hole Anchor, Pick-and-Place Ready
Through-hole termination gives a mechanical anchor that resists shear from cable strain better than an SMT equivalent. The header ships in a tube and includes pick-and-place features for automated assembly — the flat top surface allows vacuum pickup without a dedicated nozzle. The black insulation colour is standard for AMPMODU headers.
It is ROHS3 compliant.
Peer Comparison: 20 vs 10 Positions
Compared to the 10-position sibling 1376779-2, this 1-2842131-0 doubles the circuit count to 20 positions in the same 2.00mm pitch and dual-row layout. The extra rows add board-edge density without changing the footprint pitch — the row spacing and solder tail length are identical, so the PCB keep-out area scales linearly with position count.