The 3-Position Power Header for High-Current Board-to-Wire
The TE Connectivity Dynamic D-5200 1-353081-2 is a 3-position, single-row header with a 10.16mm pitch, designed for board-to-wire power applications in industrial and general-purpose equipment. It carries 30A per circuit at 630V, making it a serious power interconnect — not a signal line. The shrouded 4-wall housing with detent lock and board locks holds the header during soldering and resists vibration. Gold mating contacts at 15.0µin and tin solder tails protect the critical interface while keeping termination cost-effective. The IP20 rating means it is finger-safe but not sealed — keep it away from moisture and washdown areas.
The 30A per circuit at 630V is bus-level current — this header is sized for power distribution, not signal. At this pitch, the board layout has room for wide traces or copper pours on each circuit. The tin solder tails are standard for through-hole wave soldering; no special plating is needed on the board side. Without them, the right-angle orientation would be vulnerable to levering forces from the wire bundle.
There is no official second-source or direct cross on record; the 1-1871673-2 is a different series (2.50mm pitch, 4 positions) and is not a functional substitute.