It carries a 10.16 mm pitch — wide enough to handle the 30 A per circuit rating without crowding the board — and is rated for 630 V, making it a genuine power interconnect rather than a signal header.
The 30 A per circuit at 630 V is a bus-level rating. The 10.16 mm pitch provides creepage for 630 V. The gold plating thickness is 30.0 µin. The board lock is a practical feature for production: it prevents the header from lifting off the board during wave solder, especially when the cable assembly is heavy.