The 1-645986-2: The beryllium copper contact provides consistent spring force over repeated mating cycles, and the 150.0 µinch tin finish suits moderate-cycle, cost-sensitive interconnects where gold is not required. The socket mounts through a PCB with a hole diameter of 0.062" and supports board thicknesses from 0.031" to 0.125". Solder termination secures the connection, and the no-tail design keeps the overall length at 0.290" – a compact profile for tight board stacks. The socket depth of 0.148" to 0.260" accommodates varying pin lengths from the mating header.
Sourcing an Obsolete Part
Availability is lot-specific – submit an RFQ for current sourcing status.
This socket mates with header pins in the 0.028" to 0.033" diameter range – typical for TE Series 3 headers. The solder termination and 0.062" mounting hole diameter mean it fits standard through-hole PCB layouts. Confirm the mating header's pin diameter and board thickness before committing the BOM line.