14-Circuit Right-Angle Header with Board Lock
Right-Angle Board Edge Routing
The insulation height of 0.290" (7.37mm) gives the mated receptacle clearance above the board surface. The 0.118" (3.00mm) row spacing matches the pitch, so the dual-row footprint occupies a 3.00mm × 3.00mm grid per circuit pair — a standard layout for wire-to-board interconnects in this current class.
Tin-Lead Plating and Operating Range
Tin-lead provides good solderability on the through-hole tails and reliable contact in moderate-cycle applications — expect several hundred mating cycles before wear-through.