10-Position Dual-Row Header for Wire-to-Board
The 1-794681-0: The tin-lead post finish (100.0µin) is compatible with standard through-hole solder processes.

TE Connectivity AMP Connectors Micro MATE-N-LOK header, 1-794681-0, 10 circuits, 2 rows, 3.00mm pitch, shrouded 4-wall, gold-plated male pins, through-hole solder, locking ramp, board lock, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | Micro MATE-N-LOK |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 250V |
| Current rating | Varies by Wire Gauge |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.364\" (9.25mm) |
| Insulation material | Polyamide (PA), Nylon |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Features | Board Lock |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | General Purpose |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 10 |
| Row spacing - mating | 0.118\" (3.00mm) |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.125\" (3.18mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 1-794681-0: The tin-lead post finish (100.0µin) is compatible with standard through-hole solder processes.
The 1-794681-0 header mates with a Micro MATE-N-LOK receptacle housing (e.g., 1-794680-0 series) using the appropriate crimp terminals.