Press-fit pin for solderless backplane assembly
The press-fit termination compresses into a plated through-hole, creating a gas-tight connection — eliminates solder defects and speeds up backplane assembly.
Gold plating thickness drives mating cycle life
Contact finish is gold with a thickness of 31.5 µin (0.80 µm) — this is a solid industrial-grade plating, not flash.
Board thickness and pin length fit constraints
The pin is sized for a board thickness of 0.063" (1.60 mm) — standard for most PCBs. Overall length is 0.520" (13.21 mm), with 0.025" (0.64 mm) square above and below the flange. The mounting hole diameter is 0.035" (0.89 mm).
Product status is Active. RoHS compliant. Sourced to order per RFQ. Confirm BOM quantity and board thickness before committing.