TE Connectivity AMPMODU Mod II, 102557-9, shrouded header, 10 positions, 2 rows, 0.100" (2.54mm) pitch, through-hole press-fit, gold mating contacts, 3A, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Detent Lock |
| Current rating | 3A |
| Operating temperature | -55°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.440\" (11.18mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Tray |
| Shrouding | Shrouded - 4 Wall |
| Termination | Press-Fit, Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 10 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.250\" (6.35mm) |
| Overall contact length | 0.660\" (16.76mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.320\" (8.13mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 102557-9: It is a shrouded - 4 wall design with a detent lock, ensuring positive mating retention in board-to-board or cable applications. The through-hole press-fit termination allows for solderless assembly, reducing thermal stress on the board and enabling rework-friendly connections in backplane or mezzanine stacks.
It is RoHS non-compliant due to tin-lead post plating, which may affect regulatory acceptance in some regions.
No, 102557-9 is RoHS non-compliant due to tin-lead plating on the post. This is typical for legacy or high-reliability applications where leaded solder is still permitted.
The header mates with AMPMODU Mod II receptacles or any 0.100" (2.54mm) pitch, 10-position, dual-row socket that accepts a shrouded header with detent lock. Confirm the mating half part number against your assembly drawing.