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TE Connectivity AMP Connectors 102976-8 — Pin Headers

102976-8 TE Connectivity AMPMODU Mod II Header, 8 Pos

MPN102976-8
Active

TE Connectivity AMPMODU Mod II, 102976-8, 8-position single-row unshrouded breakaway header, 0.100" (2.54mm) pitch, through-hole solder termination, gold-plated mating contacts rated 3A, UL94 V-0 black thermoplastic housing.

$0.6800Ref. price · indicative, final on quote
RoHSROHS3 Compliant
SeriesAMPMODU Mod II
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

102976-8 key specifications
ParameterValue
SeriesAMPMODU Mod II
TypeMale Pin
MountingThrough Hole
Connector typeHeader, Breakaway
Fastening typePush-Pull
Current rating3A
Operating temperature-65°C~105°C
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.090\" (2.29mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

102976-8 additional specifications
ParameterValue
StyleBoard to Board or Cable
PackageBox
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.100\" (2.54mm)
Positions8
Contact finish - postTin-Lead
Contact length - post0.125\" (3.18mm)
Overall contact length0.533\" (13.55mm)
Contact finish - matingGold
Contact length - mating0.318\" (8.08mm)
Contact finish thickness - post100.0µin (2.54µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The 102976-8 is an 8-position, single-row, unshrouded breakaway header from the TE Connectivity AMPMODU Mod II series. The male square pins accept mating receptacles from the same Mod II family, and the breakaway construction lets you snap the strip to shorter lengths if needed. The gold over nickel on the mating face resists corrosion in moderate environments, while the tin-lead post finish suits standard wave-solder processes.

Board Fit and Routing Details

The 0.100" pitch sets the board footprint: each pin sits on a 2.54 mm grid, which matches standard perfboard and many IDC socket footprints. The 0.090" (2.29 mm) insulation height keeps the header profile low above the board surface.

Material and Environmental Ratings

The gold thickness supports hundreds of mating cycles; the tin-lead post is compatible with leaded solder processes.

Sourced through independent distribution channels; quoted to order against your BOM quantity. Availability and current pricing confirmed at quote time.

Frequently asked questions

What is the pitch of the 102976-8?

The pitch is 0.100" (2.54mm), the standard 0.100-inch grid used by most prototyping boards and IDC connectors.

Is the 102976-8 RoHS compliant?

Yes, it is RoHS3 compliant. The tin-lead post finish is exempt under current RoHS legislation for lead in solder applications.