TE Connectivity AMPMODU System 50 board-to-board receptacle, 50 positions, dual-row, 1.27 mm pitch, 30 VAC, 1 A per contact, gold mating finish, right-angle through-hole solder termination, black thermoplastic housing, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | AMPMODU System 50 |
| Type | Female Socket |
| Mounting | Through Hole, Right Angle |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.217\" (5.51mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Features | Board Guide |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 50 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.100\" (2.54mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 103911-4 is a 50-position, dual-row receptacle from the AMPMODU System 50 series. The 1.27 mm (0.050-inch) mating pitch and 2.54 mm (0.100-inch) row spacing set the PCB footprint: 25 contacts per row in a staggered grid. This pitch is the tightest common spacing for this class, which means the board layout engineer must plan for fine-pitch trace escape between the through-hole posts.
The 103911-4 is the direct fit for the design; any alternative would require a board layout change.