Board-to-Board Signal Duty at 1.27mm Pitch
The 104078-3 is a 10-position, dual-row receptacle from the AMPMODU System 50 series, designed for board-to-board stacking with a 1.27mm mating pitch. Mated stack heights of 11.43mm and 12.57mm give the board layout engineer two z-height options between mezzanine boards, set by the header counterpart.
The 1.27mm pitch drives the board footprint: each contact row sits 2.54mm apart, matching the row spacing of AMPMODU System 50 headers. The 30VAC voltage rating confirms this is a signal-only interconnect, not a power path.
What the 30µin Gold Means for Field Duty
The tin-lead post finish is compatible with standard SAC305 solder processes, though the lead content may affect RoHS compliance claims for some end products.