TE Connectivity AMPMODU System 50 board-to-board receptacle, 104078-5, 50 positions, dual-row, 0.050" (1.27mm) pitch, female socket, through-hole solder termination, gold mating finish, rated 1A at 30VAC.
| Parameter | Value |
|---|---|
| Series | AMPMODU System 50 |
| Type | Female Socket |
| Mounting | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -65°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.350\" (8.89mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Parameter | Value |
|---|---|
| Mated stacking heights | 11.43mm, 12.57mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 50 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.100\" (2.54mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
This receptacle mates with a matching AMPMODU System 50 header (same pitch and row spacing) to create a board-to-board stack. The two listed mated stacking heights — 11.43mm and 12.57mm — come from the header post length selection; confirm the header part number to set the final board spacing.
The tin-lead post finish (150µin) is compatible with standard wave-solder profiles.
It belongs to the AMPMODU System 50 series, a board-to-board interconnect family from TE Connectivity AMP Connectors.