TE Connectivity AMPMODU System 50 receptacle, 104078-6, 60-position dual-row, 0.050" (1.27 mm) pitch, through-hole solder termination, gold-plated mating contacts, rated 1 A at 30 VAC, UL94 V-0 black housing.
| Parameter | Value |
|---|---|
| Series | AMPMODU System 50 |
| Type | Female Socket |
| Mounting | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.350\" (8.89mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Parameter | Value |
|---|---|
| Mated stacking heights | 11.43mm, 12.57mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 60 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.100\" (2.54mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 104078-6: The 1 A ceiling keeps temperature rise within the thermoplastic housing limits at full population.
The receptacle supports two mated stacking heights: 11.43 mm and 12.57 mm, giving the board layout engineer flexibility in mezzanine card clearance.
Packaged in a tube for through-hole assembly.
This fine pitch drives the board footprint and trace routing density for the 60-position layout.
The mating contacts are gold-plated (30 µinch) over copper alloy, suitable for signal-level interconnects with repeated mating cycles. The solder post finish is tin-lead (150 µinch).